Properties of Ag-Au-Ge medium temperature solder

LI Chunyuan; WANG Xitao; YUAN Wenxia

doi:10.13374/j.issn1001-053x.2008.12.008

Volume 30 Issue 12

Aug. 2021

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LI Chunyuan, WANG Xitao, YUAN Wenxia. Properties of Ag-Au-Ge medium temperature solder[J]. Chinese Journal of Engineering, 2008, 30(12): 1402-1405. doi: 10.13374/j.issn1001-053x.2008.12.008

Citation:

LI Chunyuan, WANG Xitao, YUAN Wenxia. Properties of Ag-Au-Ge medium temperature solder[J]. Chinese Journal of Engineering, 2008, 30(12): 1402-1405. doi: 10.13374/j.issn1001-053x.2008.12.008

LI Chunyuan, WANG Xitao, YUAN Wenxia. Properties of Ag-Au-Ge medium temperature solder[J]. Chinese Journal of Engineering, 2008, 30(12): 1402-1405. doi: 10.13374/j.issn1001-053x.2008.12.008

Citation:

LI Chunyuan, WANG Xitao, YUAN Wenxia. Properties of Ag-Au-Ge medium temperature solder[J]. Chinese Journal of Engineering, 2008, 30(12): 1402-1405. doi: 10.13374/j.issn1001-053x.2008.12.008

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Properties of Ag-Au-Ge medium temperature solder

doi: 10.13374/j.issn1001-053x.2008.12.008

1. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China;
2. School of Applied Science, University of Science and Technology Beijing, Beijing 100083, China

Received Date: 2008-01-18
Rev Recd Date: 2008-03-13

Available Online: 2021-08-06

Abstract

Abstract

Two eutectic alloys, AAG1 and AAG2, were selected as solder according to the Ag-Au-Ge ternary phase diagram. The solder alloys were prepared by vacuum melting. The melting point, wettability, microstructure of the solder alloys and the interface between solder and Al-SiC/Ni/Au substrate were investigated. The results show that these two solder alloys have large temperature gap between solidus and liquidus. The temperature of solidus and liquidus are 410.0℃; and 449.8℃ for AAG1 and 401.1℃ and 441.0℃ for AAG2, respectively. The alloy AAG1 has good wettability to the substrate. Both two solder alloys have good adhesion with the substrate. No intermetallic phase was found at the interface. It is concluded that the alloy AAG1 could be possibly used as the solder for 400-500℃.
- solder,
- melting property,
- wettability,
- medium temperature