Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film

Xue Jiangyun; Wu Jixun; Yang Dejun

doi:10.13374/j.issn1001-053x.1996.s2.010

Volume 18 Issue S2

Nov. 2021

Turn off MathJax

Article Contents

Article Navigation > Chinese Journal of Engineering > 1996 > 18(S2): 46-49

Xue Jiangyun, Wu Jixun, Yang Dejun. Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film[J]. Chinese Journal of Engineering, 1996, 18(S2): 46-49. doi: 10.13374/j.issn1001-053x.1996.s2.010

Citation:

Xue Jiangyun, Wu Jixun, Yang Dejun. Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film[J]. Chinese Journal of Engineering, 1996, 18(S2): 46-49. doi: 10.13374/j.issn1001-053x.1996.s2.010

Xue Jiangyun, Wu Jixun, Yang Dejun. Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film[J]. Chinese Journal of Engineering, 1996, 18(S2): 46-49. doi: 10.13374/j.issn1001-053x.1996.s2.010

Citation:

Xue Jiangyun, Wu Jixun, Yang Dejun. Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film[J]. Chinese Journal of Engineering, 1996, 18(S2): 46-49. doi: 10.13374/j.issn1001-053x.1996.s2.010

PDF( 342 KB)

Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film

doi: 10.13374/j.issn1001-053x.1996.s2.010

Department of Surface Science and Corrosion Engineering, USTB, Beijing 100083, PRC

Received Date: 1996-06-15
Available Online: 2021-11-13

Abstract

Abstract

The mechanism of electrodeposition of Cu/Ni multilayer thin films from citrate salt electrolyte has been studied by means of potentodynamic sweep, cyclic voltammetry sweep and AC impendence.The results indicated that the copper deposition is mass transfer controlled process and nickel deposition is related to the absorbed intermediate species such as Ni(OH)_ads. The nickel ions first form Ni(OH)_ads,then was deoxygenated to nickel on the electrode surface.
- AC Impendence,
- electrodeposition,
- Cu/Ni alloy,
- multilayer film