Pulsed Electroless Nickel-Phosphorus Deposits and Thier Performances

Hu Maopu; Wang Baojue; Wang Meirong; Zhang Wenqi

doi:10.13374/j.issn1001-053x.1990.02.021

Volume 12 Issue 2

Nov. 2021

Turn off MathJax

Article Contents

Article Navigation > Chinese Journal of Engineering > 1990 > 12(2): 109-113

Hu Maopu, Wang Baojue, Wang Meirong, Zhang Wenqi. Pulsed Electroless Nickel-Phosphorus Deposits and Thier Performances[J]. Chinese Journal of Engineering, 1990, 12(2): 109-113. doi: 10.13374/j.issn1001-053x.1990.02.021

Citation:

Hu Maopu, Wang Baojue, Wang Meirong, Zhang Wenqi. Pulsed Electroless Nickel-Phosphorus Deposits and Thier Performances[J]. Chinese Journal of Engineering, 1990, 12(2): 109-113. doi: 10.13374/j.issn1001-053x.1990.02.021

Citation:

PDF( 493 KB)

Pulsed Electroless Nickel-Phosphorus Deposits and Thier Performances

doi: 10.13374/j.issn1001-053x.1990.02.021

1. Dcpt. of Chemistry;
2. Dept. of Surface Sci. and Corro. Eng.

Received Date: 1989-04-12
Available Online: 2021-11-15
Publish Date: 2021-11-15

Abstract

Abstract

The superposition of pulsed current on the electroless reaction is referred to the pulsed electroless plating. The effects of pulsed parameters (pulsed current desities and duty cycles) and temperatures on the compositions and performances of deposits and the depositing rates are investigated. The results showed that the depositing rates are accelerated by pulsed current without any great loss in the properties of the Ni-P deposit. In addition, the enhancement of the chemical reaction for electroless nickel deposition by pulsed current is found.
- electroless,
- pulse electroplating,
- nickel,
- phosphorus,
- deposit