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金屬鎂中去孿晶過程與自間隙原子交互作用的分子動力學模擬

馬志超 湯笑之 郭雅芳

馬志超, 湯笑之, 郭雅芳. 金屬鎂中去孿晶過程與自間隙原子交互作用的分子動力學模擬[J]. 工程科學學報, 2021, 43(4): 545-551. doi: 10.13374/j.issn2095-9389.2020.02.18.004
引用本文: 馬志超, 湯笑之, 郭雅芳. 金屬鎂中去孿晶過程與自間隙原子交互作用的分子動力學模擬[J]. 工程科學學報, 2021, 43(4): 545-551. doi: 10.13374/j.issn2095-9389.2020.02.18.004
MA Zhi-chao, TANG Xiao-zhi, GUO Ya-fang. Atomistic simulation of detwinning process and its interaction with self-interstitial atoms in magnesium[J]. Chinese Journal of Engineering, 2021, 43(4): 545-551. doi: 10.13374/j.issn2095-9389.2020.02.18.004
Citation: MA Zhi-chao, TANG Xiao-zhi, GUO Ya-fang. Atomistic simulation of detwinning process and its interaction with self-interstitial atoms in magnesium[J]. Chinese Journal of Engineering, 2021, 43(4): 545-551. doi: 10.13374/j.issn2095-9389.2020.02.18.004

金屬鎂中去孿晶過程與自間隙原子交互作用的分子動力學模擬

doi: 10.13374/j.issn2095-9389.2020.02.18.004
基金項目: 國家自然科學基金“面上”資助項目(11972071,11772043)
詳細信息
    通訊作者:

    E-mail: yfguo@bjtu.edu.cn

  • 中圖分類號: TG146.22

Atomistic simulation of detwinning process and its interaction with self-interstitial atoms in magnesium

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  • 摘要: 采用分子動力學方法研究了鎂中$\left\{ {10\bar 12} \right\}$拉伸孿晶在剪切載荷下的去孿晶過程,并探討了去孿晶過程中孿晶界面與自間隙原子的交互作用。研究結果表明:去孿晶過程中共格孿晶界對自間隙原子具有吸附作用,自間隙原子被共格孿晶界吸附并隨之遷移,且隨著共格孿晶界的消失而被釋放。通過吸收和釋放這兩種交互作用,去孿晶過程將導致自間隙原子分布更為密集。研究進一步給出了共格孿晶界對自間隙原子的吸附機理,即共格孿晶界存在一個自間隙原子的自發吸收區,0 K下寬度約為0.752 nm,273 K下約為3.59 nm。去孿晶過程與自間隙原子的交互作用也將導致自間隙原子構型的變化。由于自間隙原子的密集分布可在更長時間尺度上誘發位錯環等晶體缺陷,這一研究有助于深入理解鎂及鎂合金的疲勞力學性能。

     

  • 圖  1  模型示意圖(圖中孿晶界處原子與間隙原子均被放大顯示,黑色虛折線標識了孿晶內外的基平面)

    Figure  1.  Schematic of simulation model (Atoms at the coherent twin boundaries (CTBs) and the self-interstitial atoms (SIAs) are magnified for observation. The black dotted lines denote the basal planes inside and outside the twin)

    圖  2  密排六方金屬中可能存在的8種間隙構型示意圖(a)及本文分子動力學模擬中存在的間隙構型(b)

    Figure  2.  Schematic of eight possible configurations of SIAs in hcp metals (a) and configurations obtained in this work (b)

    圖  3  去孿晶過程(a)及去孿晶過程與自間隙原子交互作用(b)(圖中的虛線所示為孿晶內外兩部分晶體各自的基面。原子按其勢能大小著色。晶界處原子與間隙原子均被放大顯示,以便觀察)

    Figure  3.  Detwinning process (a) and interaction between the CTBs and the SIAs (b) (The dotted lines denote the basal planes inside and outside the twin. Atoms are colored according to potential energy. Atoms on the CTB and in the interstitial structure are magnified for observation)

    圖  4  NEB計算的系統勢能形貌(a);0 K時自間隙原子位于自發吸收區內被共格孿晶界吸收的過程(b)(原子按其勢能大小著色,孿晶界處原子與間隙原子均被放大顯示);從[0001]方向觀察吸收的路徑(c);從$\left[ {1\bar 210} \right]$$\left[ {\bar 1011} \right]$兩個方向上觀察被共格孿晶界吸收后間隙原子的構型(d)(原子按其勢能大小著色,左圖晶界處原子與間隙原子均被放大顯示,以便觀察)

    Figure  4.  Potential energy landscape (a) associated with the atomic configurations described in (b); Process of SIA absorption by CTB in the spontaneous absorption region at 0 K (b) (Atoms are colored according to potential energy. Atoms on the CTB and in the interstitial structure are magnified for observation); Path of absorption observed in the [0001] direction (c); Configurations of SIAs absorbed by the CTB observed in the directions of $\left[ {1\bar 210} \right]$ and $\left[ {\bar 1011} \right]$ (d) (Atoms are colored according to potential energy. Atoms on the CTB and in the interstitial structure are magnified for observation in the left part)

    圖  5  273 K時自間隙原子位于自發吸收區內被共格孿晶界吸收的過程(原子按其勢能大小著色,孿晶界處原子與間隙原子均被放大顯示)

    Figure  5.  Process of SIA absorption by a CTB in the spontaneous absorption region at 273 K (Atoms are colored according to potential energy. Atoms on the CTB and in the interstitial structure are magnified for observation)

    圖  6  0 K孿晶位錯與共格孿晶界上自間隙原子的交互作用(a)(原子按其勢能大小著色。晶界、用于參照的基平面,以及間隙結構中的原子均被放大顯示,以便觀察),及NEB計算的系統勢能形貌(b)

    Figure  6.  Interaction of TDs and SIAs (a) (Atoms are colored according to potential energy. The atoms in twin boundary, basal planes for reference and in the interstitial structure are magnified for observation), potential energy landscape (b) associated with the atomic configurations described in (a)

    圖  7  自間隙原子被共格孿晶界釋放的過程(晶界及間隙結構中的原子均被放大顯示)

    Figure  7.  Release of SIAs by the CTB (Atoms on the CTB and in the interstitial structure are magnified)

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  • 收稿日期:  2020-02-18
  • 刊出日期:  2021-04-26

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