Microstructure and properties of Cu–Al-laminated composites fabricated via formation of a horizontal continuous casting composite
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摘要: 提出了一種可以制備冶金結合界面雙金屬復合板帶的水平連鑄復合成形新工藝，其具有短流程、高效的特點。采用該工藝制備了截面尺寸為70 mm×24 mm（寬度×厚度）的銅鋁復合板，獲得了可行的制備參數，研究了所制備板坯的組織形貌和性能。結果表明，銅鋁復合板制備成形過程中，會形成由金屬間化合物和共晶相組成的復合界面層。鋁液和銅板表面接觸，發生固液轉變形成（II）層：θ相。隨著銅原子不斷的向鋁液中擴散，當銅原子含量達到一定程度，θ相發生固相轉變形成（I）層：γ相。達到共晶溫度時，發生共晶轉變形成（III）層：α+θ共晶組織。其中I層和II層均為銅鋁金屬間化合物，是裂紋產生和擴展的主要區域，因此界面層厚度是決定結合強度的重要因素。通過調整工藝參數可以優化凝固過程中銅鋁復合板內的溫度場分布，進而控制復合界面層的形成過程，因此工藝參數之間的合理匹配是改善復合層組織結構和增大板坯結合強度的關鍵。Abstract: With the advantages of both Cu and Al, including high conductivity, good corrosion resistance, low density, and easy connectivity, Cu–Al-laminated composites become a substitute for copper plates which can be applied widely in the fields of telecommunication, the petrochemical industry, transportation, decorative buildings, and the aerospace, national defense, and military industries. Cu–Al-laminated composites can be prepared via various methods, such as the explosive combined method, rolling combined method, and cast-rolling combined method. However, all these methods are limited because of the complicated metal surface treatment which poses a restriction on the development of this kind of plate. To resolve this issue, a new process of horizontal continuous casting composite forming (HCCF) for bimetal composite plates with an interface of metallurgical bonding, which is regarded as a short and more efficient process, was presented in this paper. Cu–Al composite plates with a section size of 70 mm × 24 mm (width × thickness) were fabricated, whose feasible preparation parameters were further studied, along with the investigation of the microstructure and properties of the composite plate. The results show that consisting of intermetallic compounds and eutectic phase, an interfacial layer is formed during the preparation and formation of the Cu–Al composite plate. Layer II of θ is formed via a solid–liquid transition during the solidification of liquid Al on the solid Cu plate. With the Cu atoms continuously diffusing into the Al liquid, layer I of γ is formed via a solid–solid transition with a certain content of Cu atoms, while layer III of α + θ is formed via eutectic transformation under the eutectic temperature. Making of Cu–Al intermetallic compounds, Layer I and layer II are the main areas of crack generation and expansion, thus, the thickness of the interface layer plays an important role that can control bonding strength. The temperature distribution of the composite Cu–Al plate during solidification is optimized by adjusting the parameters and controlling the formation of the composite layer. Therefore, a reasonable matching of the process parameters is the key to improving the microstructure of the composite layer and increasing the bond strength of the clad plate.
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圖 3 采用水平連鑄復合成形技術制備的銅鋁復合板坯宏觀照片, 規格：70 mm×24 mm（寬度×厚度）
Figure 3. Macroscopic photographs of the Cu–Al composite plate prepared via HCCF, size of the section: 70 mm × 24 mm (width × thickness)
圖 4 銅鋁復合板復合界面的顯微結果和元素分布. （a） 界面組織結構；（b） 圖（a）中框圖放大圖；（c） AB能譜線掃描分析結構；（d） CD能譜線掃描分析結果
Figure 4. Microstructure and elemental distribution at the composite interface of the Cu–Al composite plate: (a) microstructure of the interface; (b) magnifying of rectangular diagram in (a); (c) EDS line scan analysis results of AB; (d) EDS line scan analysis results of CD
圖 5 銅鋁復合板坯拉剪斷裂面的 X 射線衍射圖譜. （a） 1#試樣銅側斷面；（b） 1#試樣鋁側斷面；（c） 2#試樣銅側斷面；（d） 2#試樣鋁側斷面
Figure 5. X-ray diffraction spectrum of tension–shear fracture of the surface of the Cu–Al composite plate: (a) fracture surface of 1# sample copper side; (b) fracture surface of 1# sample aluminum side; (c) fracture surface of 2# sample copper side; (d) fracture surface of 2# sample aluminum side
圖 6 銅鋁復合板坯拉剪斷裂面的BSD圖
Figure 6. BSD diagram of the tension–shear fracture of the surface of the Cu–Al composite plate
圖 7 工藝參數對銅鋁復合板坯復合界面層厚度的影響
Figure 7. Effect of the technological parameters on the interfacial thickness of the Cu–Al composite plate
圖 8 工藝參數對銅鋁復合板坯界面結合強度的影響
Figure 8. Effect of the technological parameters on the interfacial bonding strength of the Cu–Al composite plate
圖 9 銅鋁復合板坯界面顯微硬度. （a） 低倍; （b） 高倍
Figure 9. Interface microhardness of the Cu–Al composite plate: (a) low magnification; (b) high magnification
圖 10 不同軋制溫度銅鋁復合板坯軋制后表面形貌. （a） 200 ℃; （b） 250 ℃; （c） 300 ℃
Figure 10. Surface morphologies of Cu–Al composite plates rolled at different rolling temperatures: (a) 200 ℃; (b) 250 ℃; (c) 300 ℃
圖 11 不同拉坯速率下復合層和結合強度的關系
Figure 11. Relation between composite layer and bonding strength at different drawing rates
圖 12 復合層形成過程示意圖. （a） 固液轉變階段；（b） 固相轉變階段；（c） 共晶轉變階段
Figure 12. Diagram of the composite layer formation process: (a) stage of solid?liquid phase transformation; (b) stage of solid phase transformation; (c) stage of eutectic transformation
圖 13 工藝參數對θ相和γ相形成和生長的影響. （a） V=40 mm·min?1，Q=1000 L·h?1；（b） V=60 mm·min?1，Q=1000 L·h?1；（c） V=80 mm·min?1，Q=1000 L·h?1；（d） V=100 mm·min?1，Q=1000 L·h?1；（e） V=60 mm·min?1，Q=800 L·h?1
Figure 13. Effects of the technological parameters on the formation and growth of the θ and γ phases: (a) V=40 mm·min?1, Q=1000 L·h?1; (b) V=60 mm·min?1, Q=1000 L·h?1; (c) V=80 mm·min?1, Q=1000 L·h?1; (d) V=100 mm·min?1, Q=1000 L·h?1; (e) V=60 mm·min?1, Q=800 L·h?1
編號 Cu原子數分數/% Al原子數分數/% 相種類 編號 Cu原子數分數/% Al原子數分數/% 相種類 1 74.38 25.62 γ 5 14.41 85.59 α + θ 2 31.60 68.40 θ 6 16.85 83.15 α + θ 3 34.03 65.97 θ 7 19.40 80.60 α + θ 4 20.37 79.63 α + θ 8 16.33 83.67 α + θ 
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編號 Cu原子數分數/% Al原子數分數/% 銅鋁原子比 1 61.98 38.02 9∶4 2 31.27 68.73 1∶2 3 67.01 32.99 9∶4 4 33.32 66.68 1∶2
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