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超聲外場對SiCp/7085復合材料顆粒微觀團聚與界面結合的作用機理

王坤 張立華 黎正華 蔣文 李暢梓

王坤, 張立華, 黎正華, 蔣文, 李暢梓. 超聲外場對SiCp/7085復合材料顆粒微觀團聚與界面結合的作用機理[J]. 工程科學學報, 2017, 39(2): 238-243. doi: 10.13374/j.issn2095-9389.2017.02.011
引用本文: 王坤, 張立華, 黎正華, 蔣文, 李暢梓. 超聲外場對SiCp/7085復合材料顆粒微觀團聚與界面結合的作用機理[J]. 工程科學學報, 2017, 39(2): 238-243. doi: 10.13374/j.issn2095-9389.2017.02.011
WANG Kun, ZHANG Li-hua, LI Zheng-hua, JIANG Wen, LI Chang-zi. Mechanism of ultrasonic field on the particle micro-agglomeration and interfacial bonding of SiCp/7085 composites[J]. Chinese Journal of Engineering, 2017, 39(2): 238-243. doi: 10.13374/j.issn2095-9389.2017.02.011
Citation: WANG Kun, ZHANG Li-hua, LI Zheng-hua, JIANG Wen, LI Chang-zi. Mechanism of ultrasonic field on the particle micro-agglomeration and interfacial bonding of SiCp/7085 composites[J]. Chinese Journal of Engineering, 2017, 39(2): 238-243. doi: 10.13374/j.issn2095-9389.2017.02.011

超聲外場對SiCp/7085復合材料顆粒微觀團聚與界面結合的作用機理

doi: 10.13374/j.issn2095-9389.2017.02.011
基金項目: 

國家自然科學基金資助項目(51475480,51575539);中南大學研究生自主創新資助項目(2016zzts308)

詳細信息
  • 中圖分類號: TG146.2

Mechanism of ultrasonic field on the particle micro-agglomeration and interfacial bonding of SiCp/7085 composites

  • 摘要: 采用半固態混合-機械攪拌-超聲施振的方法制備了體積分數為10%的SiCp/7085復合材料,通過金相顯微鏡、掃描電鏡和X射線衍射對顆粒分布與界面進行研究,重點研究超聲外場對復合材料顆粒團聚與界面結合的作用機理.實驗結果表明:單純機械攪拌對400目顆粒的團聚與界面結合的作用效果有限;超聲外場下,空化作用產生的微射流與瞬時高溫高壓能夠有效破除顆粒團聚體的包裹層,打散顆粒;超聲破除顆粒表面氧化膜,除去氣體層,使熔體中的鎂元素與顆粒直接接觸并反應是改善熔體與顆粒潤濕性的重要因素;最終在界面處生成MgAl2O4強化相,從而獲得更優的界面結合.

     

  • [8] Ma J Y, Kang J W, Huang T Y. Novel application of ultrasonic cavitation for fabrication of TiN/Al composites. J Alloys Compd, 2016, 661:176
    [9] Hong S, Wu Y P, Zhang J F, et al. Ultrasonic cavitation erosion of high-velocity oxygen-fuel (HVOF) sprayed near-nanostructured WC-10Co-4Cr coating in NaCl solution. Ultrason Sonochem, 2015, 26:87
    [10] Macwan A, Patel V K, Jiang X Q, et al. Ultrasonic spot welding of Al/Mg/Al tri-layered clad sheets. Mater Des, 2014, 62:344
    [13] Lee K B, Kwon H. Strength of Al-Zn-Mg-Cu matrix composite reinforced with SiC particles. Metall Mater Trans A, 2002, 33(2):455
    [16] Luo Z P. Crystallography of SiC/MgAl2O4/Al interfaces in a pre-oxidized SiC reinforced SiC/Al composite. Acta Mater, 2006, 54(1):47
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  • 被引次數: 0
出版歷程
  • 收稿日期:  2016-04-15

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