Microstructure and electric conductivity of(SiC)TiN/Cu composites
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摘要: 以醇鹽水解-氨氣氮化法在SiC顆粒表面包覆TiN,然后采用放電等離子體燒結制備出(SiC)TiN/Cu復合材料.結果表明:醇鹽水解-氨氣氮化法能夠制備出TiN包覆SiC復合粉末,TiN包覆層均勻連續,TiN顆粒的粒徑為30~80nm.TiN包覆層能夠促進復合材料的致密化并改善界面結合.(SiC)TiN/Cu復合材料的電導率介于15.5~35.7 m·Ω-1·mm-2之間,并且隨著SiC體積分數的增加而降低.TiN包覆層和基體中網絡結構TiN的存在能夠有效提高復合材料的電導率.復合材料的電導率較接近P.G模型的預測值.Abstract: TiN-coated SiC particles were prepared by the combination of alkoxide-hydrolysis and ammonia-nitridation. The coated composite powder was consolidated by spark plasma sintering. The results indicate that alkoxide-hydrolysis in combination with ammonia-nitridation is a suitable technique to produce TiN-coated SiC particles. The TiN film is thin and continuous, and the TiN particle size is about 30 to 80 nm, which is favorable to improve the densification and enhance interfacial bonding between the reinforcement and the matrix. The electric conductivity of (SiC) TiN/Cu composites is in the range of 15.5 to 35.7 m·Ω-1·mm-2 and decreases with increasing SiC content. The TiN film and the formation of a TiN network in the matrix contribute to the enhancement of electric conductivity. Additionally, the electric conductivity of the composites is more close to data predicted by the P. G model.
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Key words:
- composite materials /
- silicon carbide /
- titanium nitride /
- copper /
- electric conductivity /
- microstructure
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