Effect of electro-pulse modification on the growth kinetics of hot dip galvanizing
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摘要: 采用正交試驗的方法,研究了電脈沖處理對熱鍍鋅鍍層生長動力學的影響.以合金層生長速率時間指數為評價指標對電脈沖處理效果進行了優化.正交試驗結果表明,電脈沖處理參數中電容量是主要影響因素,處理時間影響不明顯,在電容量200μF,電壓700 V,頻率2 Hz,處理時間30 s的條件下作用效果較好.在此參數條件下的熱鍍鋅實驗結果表明:合金層的生長受到抑制,厚度減薄,組織變得均勻致密;合金層生長速率時間指數由0.717下降到0.428,合金層的生長方式由界面反應和擴散聯合控制轉變為僅受擴散控制.Abstract: The influence of electro-pulse modification on the growth kinetics of hot-dip galvanizing coatings was studied through an orthogonal test method. The time exponent of growth rate was taken as an evaluation index to optimize the treatment effect of electropulse modification. Orthogonal experiment results show that pulse capacitance has the most significant influence on the growth of the alloy layer, but the influence of treating time is little. The effect of electro-pulse modification would be better in the condition of the capacitance of 200 μF, the voltage of 700 V, the pulse frequency of 2 Hz, and the treating time of 30 s. Hot-dip galvanizing experimental results at these optimum parameters show that the growth of the alloy layer is inhibited, the coating thickness is decreased, and the structure is more dense and uniform. The time exponent of growth rate decreases from 0.717 to 0.428. The growth pattern of the alloy layer transforms from integrated control by interface reaction and diffusion to independent control by diffusion.
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Key words:
- plates /
- surface treatment /
- hot dip galvanizing /
- electric pulse /
- orthogonal design /
- growth kinetics /
- growth rate
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