Molecular dynamics simulation of liquid Cu during isothermal solidification
-
摘要: 使用Tight-binding勢函數,對液態Cu在等溫凝固過程中的結構變化進行了分子動力學模擬(MD模擬)計算,得到體系在不同溫度下的雙體分布函數和配位數分布等靜態結構信息,對等溫凝固過程中FCC短程有序結構可能發生的變化以及由此導致的H-A鍵型變化進行了分析,并結合鍵對分析方法計算了不同弛豫時間下典型短程有序結構的分布.計算表明,在Cu凝固結晶相變過程中1551鍵應是先向1541鍵轉化,初始三維結構的形成可能主要依賴于Cu原子在兩個方向上的擴散和弛豫.Abstract: A series of molecular dynamics simulations for the structure transformation of liquid Cu during isothermal solidification were performed with the Tight-binding potential. Static structural information on the pair distribution functions and the coordination number distribution at different temperatures were obtained while an analysis was carried out on the possible change of short-range ordered structure of FCC crystal and its resultant types of atom pairs by means of the Honeycutt-Anderesen pair analysis technique. The results indicate that the 1551 bonds change into the 1541 bonds during solidification process and the formation of initial three-dimensional structure depends mainly on the diffusion and relaxation of Cu atoms in two directions.
-
Key words:
- liquid copper /
- isothermal solidification /
- molecular dynamics simulation
-

計量
- 文章訪問數: 260
- HTML全文瀏覽量: 73
- PDF下載量: 7
- 被引次數: 0