Ag-Au-Ge中溫釬料的性能

李春元; 王西濤; 袁文霞

doi:10.13374/j.issn1001-053x.2008.12.008

Ag-Au-Ge中溫釬料的性能

doi: 10.13374/j.issn1001-053x.2008.12.008

1. 北京科技大學新金屬材料國家重點實驗室, 北京 100083;
2. 北京科技大學應用科學學院, 北京 100083

基金項目:

北京科技大學422人才計劃資助項目(No.200504)

教育部新世紀人才計劃資助項目(No.NCET-05-0104)

詳細信息

作者簡介:
李春元(1983-),男,碩士研究生;王西濤(1968-),男,教授,博士生導師,E-mail:xitaowang@gmail.com

中圖分類號: TG136⁺.3;TG425
計量
- 文章訪問數: 208
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- 被引次數: 0
出版歷程
- 收稿日期: 2008-01-18
- 修回日期: 2008-03-13
- 網絡出版日期: 2021-08-06

Properties of Ag-Au-Ge medium temperature solder

1. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China;
2. School of Applied Science, University of Science and Technology Beijing, Beijing 100083, China

摘要

摘要: 通過分析Ag-Au-Ge體系三元相圖,根據其存在的共晶單變線e₁e₂,制備了兩種接近共晶成分的Ag-Au-Ge釬料合金(AAG1和AAG2),研究了釬料合金的熔點、潤濕性等性能,觀察了合金的顯微組織以及合金與Al-SiC/Ni/Au基板的結合界面.實驗結果顯示:AAG1合金的固相線和液相線的溫度分別為410.0和449.8℃,AAG2相應的溫度為401.1和441.0℃;兩種釬料合金的固液相間距較大.AAG1對基板的潤濕性較好;兩種合金與基板的接觸性很好,界面沒有發現金屬間化合物.AAG1可以作為400~500℃的釬焊料使用.
- 釬焊料 /
- 熔化特性 /
- 浸潤性 /
- 中溫
Abstract: Two eutectic alloys, AAG1 and AAG2, were selected as solder according to the Ag-Au-Ge ternary phase diagram. The solder alloys were prepared by vacuum melting. The melting point, wettability, microstructure of the solder alloys and the interface between solder and Al-SiC/Ni/Au substrate were investigated. The results show that these two solder alloys have large temperature gap between solidus and liquidus. The temperature of solidus and liquidus are 410.0℃; and 449.8℃ for AAG1 and 401.1℃ and 441.0℃ for AAG2, respectively. The alloy AAG1 has good wettability to the substrate. Both two solder alloys have good adhesion with the substrate. No intermetallic phase was found at the interface. It is concluded that the alloy AAG1 could be possibly used as the solder for 400-500℃.
- solder /
- melting property /
- wettability /
- medium temperature