Influence of plating Cu at low current density on the corrosion resistance of the anodized AZ31 magnesium alloy
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摘要: 研究了小電流鍍銅封孔對陽極氧化AZ31鎂合金耐蝕性能的影響.AZ31鎂合金陽極氧化后,在傳統的鍍銅液中進行陰極小電流處理.SEM、EDS和XRD分析結果表明,陰極小電流處理后,在陽極氧化膜的多孔層中發生了銅的沉積.在質量分數為3.5%NaCl水溶液中測試的極化曲線表明,AZ31鎂合金陽極氧化后進行小電流鍍銅處理,可以提高自腐蝕電位,降低自腐蝕電流密度,使耐蝕性能得到顯著提高.Abstract: The influence of role sealing produced by plating Cu at low current density on the corrosion resistance of the anodized AZ31 magnesium alloy was studied. After anodization, AZ31 specimens were treated as a cathode with low current density in a traditional solution for Cu electroplating. The experimental results of SEM, EDS and XRD show that after such treatment at low current density, Cu is deposited in the porous layer of anodized film. The polarizing curves measured in 3.5% sodium chloride solution show that after plating Cu at low current density the corrosion potential of the anodized AZ31 magnesium alloy increases, and its corrosion current density reduces correspondingly, which indicate that the corrosion resistance of the anodized AZ31 magnesium alloy increases.
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Key words:
- magnesium alloys /
- anodization /
- corrosion resistance /
- copper plating
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