Effect of Si on the microstructure and thermal conductivity of pressureless infiltrated SiCp/Al composites
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摘要: 研究了Al-8Mg基體中添加Si對無壓浸滲SiCp/Al復合材料顯微組織和熱導率的影響.結果表明,Si能夠改善Al與SiC的潤濕性,減少復合材料孔隙度,抑制界面反應,提高相對密度.不含Si時,Al與SiC界面反應嚴重,并且潤濕性較差,導致復合材料的熱導率和相對密度較低;當基體中添加質量分數12%的Si時,界面反應受到完全抑制,熱導率取得最大值;進一步提高基體中Si含量,由于鋁基體的熱導率隨Si含量的增加而降低,導致復合材料的熱導率也隨之降低.
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關鍵詞:
- SiCp/AL復合材料 /
- 無壓浸滲 /
- 顯微組織 /
- 熱導率
Abstract: The effects of the amount of Si added to Al-8Mg alloy on the microstructure and thermal conductivity of pressureless infiltrated SiCp/Al composites were investigated. The results show that Si addition to matrix can reduce the porosity of the infiltrated composites by the improvement of SiC/Al wettability, suppress the SiC/Al interracial reaction and increase the relative density of the infiltrated composites. Without Si addition to At-SMg alloy, the composites exhibited a lower thermal conductivity and relative density because of poor wettability and severe interracial reaction. With increasing the Si content to 12%, the interracial reaction was suppressed and the thermal conductivity of the composites is the maximum. With further increasing Si content, the thermal conductivity of the composites decreased because the thermal conductivity of matrix itself decreased.-
Key words:
- SiCp/Al composites /
- pressureless infiltration /
- microstructure /
- thermal conductivity
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