Fabrication of the electronic package box preform of SiCp/Al composites by powder injection molding
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摘要: 對碳化硅陶瓷注射喂料進行流變性能分析后得到合適的注射喂料.通過注射工藝和后續的脫脂-預燒結工藝成功制備出壓滲用SiCp封裝盒體的預成形坯.結果表明:SiCp裝載量為65%,粘結劑成分為70%PW(石蠟)+29%HPDE(高密度聚乙烯)+1%SA(硬脂酸)的喂料在較寬的剪切速率和溫度范圍內均具有良好的注射性能;在合適的注射參數下可以制得完整無缺陷的注射坯;采用溶劑脫脂與熱脫脂兩步脫脂工藝,可以成功脫除注射坯體中的粘結劑,在1150℃進行預燒結,制備出了具有良好外觀形貌、足夠強度以及適中連通孔隙的預成形坯,可以滿足后續加壓滲鋁制備SiCp/Al復合材料的封裝盒體實驗的要求.Abstract: Suitable feedstock was obtained after analyzing the rheological properties of silicon carbide ceramics. SiCp package box performs used in pressure infiltration experiment were manufactured through powder injection molding and debinding-pre-sintering process. Experimental results showed that the feedstork with 65% SiCp load and 70% PW (paraffin wax) + 29% HPDE (high-density polyethylene) + 1% SA (stearic acid) had the best injection properties in the wide ranges of temperature and shear rate. The injection part with no defects could be manufactured at suitable injection parameters. The debinder was successfully removed from the injection part by solvent and thermal debinding process. SiCp package box preforms with good appearance, enough strength and proper porosity were obtained by pre-sintering process at 1 150℃, which was up to the request of following pressure infiltration experiment to fabricate SiCp/Al composites package boxes.
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Key words:
- electronic packaging materials /
- silicon carbide /
- feedstork /
- powder injection molding /
- debind
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