Dynamic Simulations of Element Mutual Diffusion during Hot Isostatic Pressing Diffusion Bonding
-
摘要: 通過DICTRA-THERMO-CALC動力學和熱力學聯合計算軟件對DD402單晶和Rene95粉末高溫合金進行熱等靜壓擴散連接反應層元素互擴散規律的模擬計算.計算結果表明,此種模擬計算方法可以較好地反應擴散偶中元素的互擴散規律,與實驗結果基本吻合.在此基礎上,分析計算了溫度和時間對擴散連接過程中Al元素互擴散規律的影響.最終得出此種模擬計算方法可以為熱等靜壓擴散連接工藝的制定和優化提供較好的理論依據.Abstract: Element mutual diffusions during hot iso-static pressing (HIP) diffusion bonding were simulated using DICRTRA-THERMO-CALC software. The calculating results show that the simulation regulations are agreeable with experimental results. Based on this simulation model, the effect of hold time and temperature on Al mutual diffusion during HIP were calculated, showing that this dynamic computer simulation can offer the processing prediction and the optimum HIP diffusion bonding processing.
-
Key words:
- superalloy /
- DD402 /
- Rene95 /
- computer simulation
-

計量
- 文章訪問數: 182
- HTML全文瀏覽量: 22
- PDF下載量: 16
- 被引次數: 0