自旋閥結構多層膜的熱穩定性

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自旋閥結構多層膜的熱穩定性

柴春林, 于廣華, 林清英, 盧政啟, 賴武彥, 朱逢吾

文章導航 > 工程科學學報 > 1999 > 21(5): 487-490

柴春林, 于廣華, 林清英, 盧政啟, 賴武彥, 朱逢吾. 自旋閥結構多層膜的熱穩定性[J]. 工程科學學報, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

引用本文:

柴春林, 于廣華, 林清英, 盧政啟, 賴武彥, 朱逢吾. 自旋閥結構多層膜的熱穩定性[J]. 工程科學學報, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

Chai Chunlin, Yu Guanghua, Lin Qingying, Lu Zhengqi, Lai Wuyan, Zhu Fengwu. Thermal Stability of Spin-valve Multilayers[J]. Chinese Journal of Engineering, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

Citation:

Chai Chunlin, Yu Guanghua, Lin Qingying, Lu Zhengqi, Lai Wuyan, Zhu Fengwu. Thermal Stability of Spin-valve Multilayers[J]. Chinese Journal of Engineering, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

柴春林, 于廣華, 林清英, 盧政啟, 賴武彥, 朱逢吾. 自旋閥結構多層膜的熱穩定性[J]. 工程科學學報, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

引用本文:

柴春林, 于廣華, 林清英, 盧政啟, 賴武彥, 朱逢吾. 自旋閥結構多層膜的熱穩定性[J]. 工程科學學報, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

Chai Chunlin, Yu Guanghua, Lin Qingying, Lu Zhengqi, Lai Wuyan, Zhu Fengwu. Thermal Stability of Spin-valve Multilayers[J]. Chinese Journal of Engineering, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

Citation:

Chai Chunlin, Yu Guanghua, Lin Qingying, Lu Zhengqi, Lai Wuyan, Zhu Fengwu. Thermal Stability of Spin-valve Multilayers[J]. Chinese Journal of Engineering, 1999, 21(5): 487-490. doi: 10.13374/j.issn1001-053x.1999.05.047

自旋閥結構多層膜的熱穩定性

doi: 10.13374/j.issn1001-053x.1999.05.047

1. 北京科技大學材料科學與工程學院, 北京 100083;
2. 鋼鐵研究總院, 北京 100081;
3. 中科院物理所, 北京 100080

作者簡介:
柴春林男,28歲,博士生

中圖分類號: TM271
計量
- 文章訪問數: 222
- HTML全文瀏覽量: 76
- PDF下載量: 6
- 被引次數: 0
出版歷程
- 收稿日期: 1999-05-26
- 網絡出版日期: 2021-08-27

Thermal Stability of Spin-valve Multilayers

1. Material Science and Engineering School, UST Beijing, Beijing 100083, China;
2. Central Iron and Steel research Institute, Beijing 100081, China;
3. Institute of physics, Chinese Academy of Science, Beijing 100080, China

摘要: 研究了Si/Ta/NiFe/Cu/NiFe/FeMn/Ta結構的自旋閥的熱穩定性及層間擴散問題.高分辨電鏡(HREM)觀察表明,各層呈柱狀晶生長.低于200℃退火能有效地提高釘扎場.高于200℃退火后,釘扎場下降,300℃時降為零.利用俄歐電子能譜儀(AES)研究了在相同的條件下制備的基片/Ta/NiFe/FeMn/Ta結構多層膜.結果表明,200℃以下時薄膜層之間主要發生沿晶界的擴散,300℃時體擴散的作用不能忽略.
- 自旋閥 /
- 熱穩定性 /
- 沿晶界擴散
Abstract: Thermal stability and interface diffusion of Si/Ta/NiFe/Cu/NiFe/FeMn/Ta spin-valve have been investigated. The columnar grains are observed by high resolution electron microscopy (HREM). The pinning field increases when annealing temperature is lower than 200℃; when the annealing temperature is higher than 200℃, the pinning field decreases and other properties deteriorates; at 300℃ the pinning field will be zero. From the results of Auger electron spectroscopy(AES), it can conclude that the diffusion among layers is mainly along grain boundary when the annealing temperature is lower than 200℃. The effect of bulk diffusion should be considered at 300℃.
- spin-valve /
- thermal stability /
- grain boundary diffusion

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PDF下載量: 6
被引次數: 0

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