SiCp/ZA22復合材料的界面

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SiCp/ZA22復合材料的界面

張維平, 胡漢起

文章導航 > 工程科學學報 > 1996 > 18(4): 316-319

張維平, 胡漢起. SiCp/ZA22復合材料的界面[J]. 工程科學學報, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

引用本文:

張維平, 胡漢起. SiCp/ZA22復合材料的界面[J]. 工程科學學報, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

Zhang Weiping, Hu Hanqi. Interface in SiCp/ZA22 Composite[J]. Chinese Journal of Engineering, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

Citation:

Zhang Weiping, Hu Hanqi. Interface in SiCp/ZA22 Composite[J]. Chinese Journal of Engineering, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

張維平, 胡漢起. SiCp/ZA22復合材料的界面[J]. 工程科學學報, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

引用本文:

張維平, 胡漢起. SiCp/ZA22復合材料的界面[J]. 工程科學學報, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

Zhang Weiping, Hu Hanqi. Interface in SiCp/ZA22 Composite[J]. Chinese Journal of Engineering, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

Citation:

Zhang Weiping, Hu Hanqi. Interface in SiCp/ZA22 Composite[J]. Chinese Journal of Engineering, 1996, 18(4): 316-319. doi: 10.13374/j.issn1001-053x.1996.04.004

SiCp/ZA22復合材料的界面

doi: 10.13374/j.issn1001-053x.1996.04.004

北京科技大學冶金系, 北京 100083

作者簡介:
張維平男 30歲博士

中圖分類號: TG185
計量
- 文章訪問數: 234
- HTML全文瀏覽量: 56
- PDF下載量: 5
- 被引次數: 0
出版歷程
- 收稿日期: 1996-01-05
- 網絡出版日期: 2021-11-13

Interface in SiCp/ZA22 Composite

Department of Metallurgy, USTB, Beijing 100083, PRC

摘要: 研究了SiC_p/ZA22復合材料的界面,根據界面反應的熱力學、能譜分析及高分辨透射電鏡的研究結果,發現SiC/α-Al界面上形成了少量Al₂MgO₄過渡層,而SiC/η-Zn間無任何反應發生。
- 復合材料 /
- 熱力學 /
- 界面
Abstract: The interface between the aluminum(or zinc) matrix and SiC was characterized by interface reaction thermodynamics,EDAX and HREM.A transition layer of Al₂MgO₄ was observed at the interface between the partly a phase and SiC,and no reaction was found at η-Zn/SiC interface.
- composite /
- thermodynamics /
- interface

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