Fe-Ni-P非晶合金的電沉積

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Fe-Ni-P非晶合金的電沉積

羅涇源, 王明生

文章導航 > 工程科學學報 > 1990 > 12(5): 491-494

羅涇源, 王明生. Fe-Ni-P非晶合金的電沉積[J]. 工程科學學報, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

引用本文:

羅涇源, 王明生. Fe-Ni-P非晶合金的電沉積[J]. 工程科學學報, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

Luo Jingyuan, Wang Mingsheng. The Electrodeposition of Amorphous FeNiP Alloy Films[J]. Chinese Journal of Engineering, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

Citation:

Luo Jingyuan, Wang Mingsheng. The Electrodeposition of Amorphous FeNiP Alloy Films[J]. Chinese Journal of Engineering, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

羅涇源, 王明生. Fe-Ni-P非晶合金的電沉積[J]. 工程科學學報, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

引用本文:

羅涇源, 王明生. Fe-Ni-P非晶合金的電沉積[J]. 工程科學學報, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

Luo Jingyuan, Wang Mingsheng. The Electrodeposition of Amorphous FeNiP Alloy Films[J]. Chinese Journal of Engineering, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

Citation:

Luo Jingyuan, Wang Mingsheng. The Electrodeposition of Amorphous FeNiP Alloy Films[J]. Chinese Journal of Engineering, 1990, 12(5): 491-494. doi: 10.13374/j.issn1001-053x.1990.05.015

Fe-Ni-P非晶合金的電沉積

doi: 10.13374/j.issn1001-053x.1990.05.015

化學系

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- 文章訪問數: 253
- HTML全文瀏覽量: 83
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出版歷程
- 收稿日期: 1989-03-07
- 網絡出版日期: 2021-11-15

The Electrodeposition of Amorphous FeNiP Alloy Films

Department of Chemistry

摘要: 研究了電沉積法制備FeNiP非晶合金的工藝條件。以抗壞血酸作為絡合劑,選擇了合適的電鍍液,研究溶液的pH、溫度和電流密度對電鍍層的影響。
- FeNiP合金 /
- 電鍍 /
- 非晶態合金
Abstract: The bright FeNiP alloy film can be electroplated with using the ascorbic acid as the complex compound. Selecting suitable bath solution, the compo sition of alloy film is depended on the technological condition of pH, temperature and cathodic current density.
- FeNiP alloy /
- eleclroplaling /
- amorphous alloy

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PDF下載量: 7
被引次數: 0

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