New Plating System for the Circle Pattern Circuit Shells
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摘要: 首次將復合電鍍技術應用于圓型電路管殼,采用由暗鎳-Ni-Al2O3-酸性脈沖金組成的新鍍層體系代替傳統的鍍層。采用上述新的鍍層體系后,可以在不增加表面鍍金層厚度的情況下,大幅度降低管殼外引線的斷裂傾向。通過批量生產性的中間試驗,摸索出符合實際生產的工藝條件。中間試驗結果表明,采用新鍍層體系后,鍍層質量得到了顯著的改善,提高了產品的抗斷腿性能,滿足"七專"外殼生產的各項技術條件。同時首次建立了鑒別管殼外引線耐蝕性的試驗方法。Abstract: The compositive plating technique is first applied to the circle pattern circuit. The new plating system consists of dark nickel, Ni-Al2O3 compositive plating and acid pulse gold plating. After application of the new plating system, the break tendency of the external leads of the shells can be decreased remarkably. On the basis of intermediate experiments for batch process, the technological factors suitable for practical process are found out. A new experimental method for evaluation of the corrosion resistance of external leads of the shells is first established by authors.
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Key words:
- Kovar /
- transistor /
- stress corrosion crack /
- plating /
- gold plating
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