Ag-Cu、Ag-H<sub>62</sub>復合電接點材料界面的原子擴散行為

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Ag-Cu、Ag-H₆₂復合電接點材料界面的原子擴散行為

周文彧, 夏守余, 陳家駿

文章導航 > 工程科學學報 > 1988 > 10(3): 313-316

周文彧, 夏守余, 陳家駿. Ag-Cu、Ag-H62復合電接點材料界面的原子擴散行為[J]. 工程科學學報, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

引用本文:

周文彧, 夏守余, 陳家駿. Ag-Cu、Ag-H₆₂復合電接點材料界面的原子擴散行為[J]. 工程科學學報, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

Citation:

Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

周文彧, 夏守余, 陳家駿. Ag-Cu、Ag-H62復合電接點材料界面的原子擴散行為[J]. 工程科學學報, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

引用本文:

周文彧, 夏守余, 陳家駿. Ag-Cu、Ag-H₆₂復合電接點材料界面的原子擴散行為[J]. 工程科學學報, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

Citation:

Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

Ag-Cu、Ag-H₆₂復合電接點材料界面的原子擴散行為

doi: 10.13374/j.issn1001-053x.1988.03.006

1. 北京鋼鐵學院;
2. 北京電工材料廠

計量
- 文章訪問數: 219
- HTML全文瀏覽量: 76
- PDF下載量: 10
- 被引次數: 0
出版歷程
- 收稿日期: 1987-07-21
- 網絡出版日期: 2021-11-15

Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials

摘要: 用掃描電鏡能譜分析半定量和定量測定,經不同熱處理工藝的Ag-Cu、Ag-H₆₂冷復合和磁控濺射復合電接點材料界面的成分分布,計算了擴散系數激活能實驗表明,材料復合界面是金屬鍵結合。
- 活化能 /
- 冷壓 /
- 擴散系數 /
- 濺射 /
- 冷復合 /
- 磁控濺射
Abstract: After the Ag-Cu and Ag-H62 electric contact materials arc made by cold press-rolling (or sputtering in magnetic field) and annealed, the quantitative and semi-quantitative analysis are carred out by scanning electron microscope. The results show that the interfaces are of metallic bonding. The diffusion coefficients and the activation energies are also calculated.
- activation energy /
- cold press /
- diffusion coefficient /
- sputtering /
- cold press rolling /
- sputtering in magnetic field

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HTML全文瀏覽量: 76
PDF下載量: 10
被引次數: 0

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