Microstructure and mechanical properties of Ti6Al4V and Al12A12 diffusion bonding interface

HUANG Xi-na; LANG Li-hui; WANG Gang; DUAN Wen

doi:10.13374/j.issn2095-9389.2017.07.008

Volume 39 Issue 7

Jul. 2017

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HUANG Xi-na, LANG Li-hui, WANG Gang, DUAN Wen. Microstructure and mechanical properties of Ti6Al4V and Al12A12 diffusion bonding interface[J]. Chinese Journal of Engineering, 2017, 39(7): 1036-1040. doi: 10.13374/j.issn2095-9389.2017.07.008

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HUANG Xi-na, LANG Li-hui, WANG Gang, DUAN Wen. Microstructure and mechanical properties of Ti6Al4V and Al12A12 diffusion bonding interface[J]. Chinese Journal of Engineering, 2017, 39(7): 1036-1040. doi: 10.13374/j.issn2095-9389.2017.07.008

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Microstructure and mechanical properties of Ti6Al4V and Al12A12 diffusion bonding interface

doi: 10.13374/j.issn2095-9389.2017.07.008

School of Mechanical Engineeringand Automation, Beihang University, Beijing 100191, China

Received Date: 2016-11-10

Abstract

Abstract

Hot isostatic pressing (HIP) was used to join two dissimilar aerospace alloys, namely Al12A12 and Ti6Al4V, for the first time. The microstructure and compositional evolutions were evaluated in the joint interface by scanning electron microscopy, energy dispersive spectroscopy, and X-ray diffraction. The microhardness and shear strength tests were applied to study the mechanical properties of the joints. As a result, different intermetallic compounds (e. g., Al₃ Ti, TiAl₂, and TiAl) form in the reaction layer of Ti/Al. The findings show that the microhardness value of the joint region is 163 HV. The highest strength in the bonding zone is 23 MPa, which exhibites a 17.9% improvement compared to that only with Cu coating, but is lower than the bonding strength with the interlayer. The fracture mode is brittle fracture due to overburden and void formation. The elements of dissimilar materials diffuse into each other during the HIP. Furthermore, various intermetallic compounds form at the interface, which affects the mechanical properties of the joints.
- hot isostatic pressing,
- diffusion bonding,
- microstructure,
- shear strength,
- microhardness

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References(18)

References

[1]	Yan J, Zeng X Y, Gao M, et al. Effect of welding wires on microstructure and mechanical properties of 2A12 aluminum alloy in CO₂ laser-MIG hybrid welding. Appl Surf Sci, 2009, 255(16):7307
[2]	Dong H G, Yu L Z, Deng D W, et al. Effect of post-weld heat treatment on properties of friction welded joint between TC4 titanium alloy and 40Cr steel rods. J Mater Sci Technol, 2015, 31(9):962
[3]	Zhao L, Cui C X, Liu S J, et al. Microstructure and mechanical properties of TC4 alloy modified and reinforced by TiB + TiN/Ti inoculants ribbons. Mater Sci Eng A, 2016, 663:8
[4]	Immarigeon J P, Holt R T, Koul A K, et al. Lightweight materials for aircraft applications. Mater Charact, 1995, 35(1):41
[5]	Fukutomi H, Nakamura M, Suzuki T, et al. Void formation by the reactive diffusion of titanium and aluminum foils. Mater Trans, JIM, 2000, 41(9):1244
[6]	Wei Y N, Li J L, Xiong J T, et al. Joining aluminum to titanium alloy by friction stir lap welding with cutting pin. Mater Charact, 2012, 71:1
[7]	Ren J W, Li Y J, Feng T. Microstructure characteristics in the interface zone of Ti/Al diffusion bonding. Mater Lett, 2002, 56(5):647
[8]	Alhazaa A N, Khan T I. Diffusion bonding of Al7075 to Ti-6Al-4V using Cu coatings and Sn-3.6Ag-1Cu interlayers. J Alloys Compd, 2010, 494(1-2):351
[9]	Kenevisi M S, Khoie S M M. A study on the effect of bonding time on the properties of Al7075 to Ti-6Al-4V diffusion bonded joint. Mater Lett, 2012, 76:144
[10]	Samavatian M, Halvaee A, Amadeh A A, et al. An investigation on microstructure evolution and mechanical properties during liquid state diffusion bonding of Al2024 to Ti-6Al-4V. Mater Charact, 2014, 98:113
[11]	Alhazaa A, Khan T I, Haq I. Transient liquid phase (TLP) bonding of Al7075 to Ti-6Al-4V alloy. Mater Charact, 2010, 61(3):312
[12]	Sohn W H, Bong H H, Hong S H. Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal. Mater Sci Eng A, 2003, 355(1-2):231
[13]	Okamoto H. Al-Ti (alumnium-titanium). J Phase Equilib, 1993, 14(1):120
[14]	Xu L, Cui Y Y, Hao Y L, et al. Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples. Mater Sci Eng A, 2006, 435-436:638
[15]	Luo J G, Acoff V L. Using cold roll bonding and annealing to process Ti/Al multi-layered composites from elemental foils. Mater Sci Eng A, 2004, 379(1-2):164
[16]	Liu J P, Luo L S, Su Y Q, et al. Numerical simulation of intermediate phase growth in Ti/Al alternate foils. Trans Nonferrous Met Soc China, 2011, 21(3):598
[17]	Romankov S, Sha W, Ermakov E, et al. Characterization of aluminized layer formation during annealing of Ti coated with an Al film. J Alloys Compd, 2006, 420(1-2):63
[18]	De Wilde J, Froyen L, Rex S. Coupled two-phase[α(Al) +θ (Al₂ Cu)] planar growth and destabilisation along the univariant eutectic reaction in Al-Cu-Ag alloys. Scr Mater, 2004, 51(6):533