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Volume 23 Issue 3
Aug.  2021
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Article Contents
LING Yunhan, LI Jiangtao, GE Changchun. Processing and Evaluation of Graded SiC/Cu Facing Plasma Composite[J]. Chinese Journal of Engineering, 2001, 23(3): 257-261. doi: 10.13374/j.issn1001-053x.2001.03.044
Citation: LING Yunhan, LI Jiangtao, GE Changchun. Processing and Evaluation of Graded SiC/Cu Facing Plasma Composite[J]. Chinese Journal of Engineering, 2001, 23(3): 257-261. doi: 10.13374/j.issn1001-053x.2001.03.044

Processing and Evaluation of Graded SiC/Cu Facing Plasma Composite

doi: 10.13374/j.issn1001-053x.2001.03.044
  • Received Date: 2001-01-08
  • A near dense graded SiC/Cu plasma facing material with a spectrum of 0-100% compositional distributions of SiC was successfully prepared by a new process termed graded sintering under ultra-high pressure. Tests on plasma relevant performances showed that the chemical sputtering CD4 yield of SiC/Cu graded composite is 80% lower than that of SMF-800 nuclear graphite, while its thermal desorption is about 10% of that graphite; Fatigue cracks and chemical decomposition were found on the surface of SiC/Cu FGM after 300 cycles of thermal impact with a power of 398 MW/m2 laser impulse, slight damage was also observed on the material surface after in-situ plasma trradiation in Tokamak apparatus.

     

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      沈陽化工大學材料科學與工程學院 沈陽 110142

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