The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling

Huang Jihua; Qian Yiyu; Jiang Yihong; Pei Jiaying

doi:10.13374/j.issn1001-053x.1993.03.028

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Article Navigation > Chinese Journal of Engineering > 1993 > 15(3): 293-297

Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

Citation:

Huang Jihua, Qian Yiyu, Jiang Yihong, Pei Jiaying. The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J]. Chinese Journal of Engineering, 1993, 15(3): 293-297. doi: 10.13374/j.issn1001-053x.1993.03.028

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The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling

doi: 10.13374/j.issn1001-053x.1993.03.028

1. Universily of Science and Technology Beijing;
2. Harbin Institute of Technology;
3. Hualin Institute of Rubber Staff

Received Date: 1992-09-17
Available Online: 2021-10-18

Abstract

Abstract

An experimental setup and a simulated ceramic chip carrier for study of the SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.
- SMT,
- thermal cycling,
- intermetallics,
- solder joint,
- reliability