Modeling and experimental analysis of micro-cutting temperature on single crystal germanium
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摘要: 針對單晶鍺微切削熱傳導問題，采用移動熱源法分別建立了在剪切滑移面熱源和前刀面摩擦熱源作用下單晶鍺的微切削溫升理論模型，計算了單晶鍺三種切削速度下的最高切削溫度，同時以同類硬脆性材料單晶硅的切削溫度對此模型進行了驗證。通過單點金剛石車削實驗，利用紅外熱像儀對單晶鍺微切削過程中的溫度進行了在線測量。實驗測量結果與模型計算結果對比發現，不同切削速度下，單晶鍺的最高切削溫度變化趨勢一致，切削速度越大溫度越高，其相對誤差在2.56%～6.64%之間；單晶硅的最高切削溫度相對誤差為3.84%。模型能夠對單晶鍺及同類硬脆性材料的溫度場進行較準確的預測，為研究其熱效應提供進一步理論支持。Abstract: Single crystal germanium is an important infrared optical material, which is widely used in defense industry, microelectronics, and other fields. It is extremely difficult to achieve the required surface quality by conventional processing methods due to its hardness and brittleness. Practically, single-point diamond tool is used for micro-cutting. During the micro-cutting process of single crystal germanium, the change of cutting temperature leads to increased tool wear and material surface hardening, which results in poor surface quality and also reduces processing accuracy. Therefore, analyzing the micro-cutting temperature distribution of single crystal germanium has become the key to better understanding its heat transfer mechanism and for improving product quality and efficiency. Aiming to analyze heat transfer mechanism of single crystal germanium micro-cutting, the moving heat source method was used. It establishes the theoretical model with temperature rise during micro-cutting of single crystal germanium under the action of the heat source of the shear slip surface and the friction heat source of the rake face and the chip, respectively. The maximum cutting temperature of germanium at three cutting speeds, and the model was verified with the cutting temperature of homogeneous hard and brittle material single crystal silicon. Through a single-point diamond turning experiment, an infrared thermal imager was used to measure the temperature of the single crystal germanium micro-cutting process online. When experimental measurement results and the model calculation results are compared, it revealed that the maximum cutting temperature of single crystal germanium has displayed same trend under different cutting speeds, which is that the cutting temperature is directly proportional to the cutting speed. The relative error is found to be between 2.56% and 6.64%. The relative error of the maximum cutting temperature is 3.84%. The model can accurately predict the temperature field of single crystal germanium and also for similar hard and brittle materials, providing further theoretical support for analyzing its thermal effects.
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圖 4 前刀面摩擦熱源及其鏡像熱源
Figure 4. Rake surface friction heat source and its mirror heat source
圖 5 單晶硅微切削溫度的理論值與實驗值對比
Figure 5. Comparison of theoretical and experimental values of single crystal silicon micro-cutting temperature
圖 7 不同切削速度下最高溫度熱像圖。（a）v=400 m·min?1；（b）v=500 m·min?1；（c）v=600 m·min?1
Figure 7. Maximum temperature thermal image at different cutting speeds: (a) v=400 m·min?1；(b) v=500 m·min?1；(c) v=600 m·min?1
圖 8 單晶鍺微切削溫度的實驗值與理論值對比
Figure 8. Comparison of experimental and theoretical values of single crystal germanium micro-cutting temperature
表 1 工件材料及切削參數[22]
Table 1. Workpiece material and cutting parameters
Parameter Value Thermal conductivity/(J·cm?1·s?1·℃?1) 0.013 Density/(g·cm?3) 5.327 Specific heat/(J·g?1·℃?1) 0.31 Shear angle/(°) 30 Wedge angle/(°) 80 
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