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熱處理對SLM-316L不銹鋼組織結構及鈍化行為的影響機制

Effect of heat treatment on the microstructure and passive behavior of 316L stainless steel fabricated by selective laser melting

  • 摘要: 對SLM-316L不銹鋼在900 ℃下進行不同時間的熱處理,結合熱處理后SLM-316L不銹鋼的組織結構和腐蝕行為研究,揭示了SLM-316L不銹鋼在900 ℃熱處理過程中組織結構的演變規律以及其對鈍化行為的作用機制。研究結果表明,900 ℃熱處理時,在組織結構方面,SLM-316L不銹鋼晶粒的基本形狀和尺寸沒有明顯變化,但是隨著保溫時間延長,SLM-316L不銹鋼中的位錯和亞晶界逐漸消失,同時伴有MnS顆粒物沿晶界析出;在耐蝕性能方面,熱處理對SLM-316L不銹鋼的耐蝕性能產生重要影響,在含有NaCl的緩沖溶液中,SLM-316L不銹鋼的點蝕電位隨著保溫時間延長逐漸降低,同時電化學阻抗逐漸減小;此外,在鈍化膜性質方面,不同熱處理時間試樣上形成的鈍化膜有明顯差異,隨著保溫時間延長,SLM-316L不銹鋼鈍化膜的厚度逐漸減小,載流子的密度以及擴散系數變大。最后,通過構建不銹鋼鈍化膜能帶結構和空間電荷層的理論模型,討論了熱處理對SLM-316L不銹鋼鈍化行為的影響機制。

     

    Abstract: Selective laser melting (SLM), a rising additive manufacturing technology, has extensive application potential because of its advantage in fabricating components with individual and complex shapes. During the SLM progress, the laser molten pool cools very quickly, leading to non-equilibrium microstructure formation and high thermal residual stress in the SLM components. Therefore, a suitable heat treatment is required to reduce the residual thermal stress and obtain excellent mechanical properties after the SLM process. In this paper, the 316L stainless steel fabricated by SLM (SLM-316L SS) is first heat-treated at 900 ℃ for 0, 0.5, 1.0, 3.0, and 5.0 h. Then, the microstructures of SLM-316L SS treated at different times are investigated using SEM, TEM, and EDS, and their corrosion resistance is estimated through electrochemical measurements. Finally, the microstructure evolution of SLM-316L SS during heat treatment at 900 ℃ is discussed based on the experimental data, and the effect of the microstructure on the formation kinetics and properties of the passive film on SLM-316L SS is explained. The results of the microstructure analysis reveal that the dislocations and sub-grain boundaries in SLM-316L SS disappeared with increasing holding time, accompanied by the precipitation of MnS inclusions, carbides, and σ phases along the grain boundaries. The potentiodynamic polarization in the buffer solution with 0.1 mol·L-1 NaCl reveals that a sample with a longer holding time shows a more negative pitting potential. According to the EIS test results, the shape of the curve in Nyquist diagram is not completely circular. The calculated film thicknesses decrease with increasing holding time. The potentiostat polarization under 0.1, 0.2, 0.3, 0.4, and 0.5 V vs SCE was used to form passive films on SLM-316L SS after heat treatments. By fitting the Mott-Schottky curves, the negative slopes demonstrate that the passive films formed on the samples are an n-type semiconductor, and the calculated point defect densities in the sample increase with the holding time. In addition, a logarithmic relationship holds between the carrier densities and the formation potentials of the passive films, and, using this relationship, the calculated diffusion coefficient of point defects across the passive film of SLM-316L SS increases with the holding time. A theoretical model related to the energy band structure and space charge layer is obtained based on the Mott-Schottky results to explain the electrochemical reaction on the passive film/solution interface.

     

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