<th id="5nh9l"></th><strike id="5nh9l"></strike><th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th><strike id="5nh9l"></strike>
<progress id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"><noframes id="5nh9l">
<th id="5nh9l"></th> <strike id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span>
<progress id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span><strike id="5nh9l"><noframes id="5nh9l"><strike id="5nh9l"></strike>
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"></span><span id="5nh9l"><video id="5nh9l"></video></span>
<th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th>
<progress id="5nh9l"><noframes id="5nh9l">

分形微通道換熱過程強化研究進展

Research progress on fractal microchannels for heat transfer process intensification

  • 摘要: 隨著微納制造技術的快速發展,微電子芯片、微反應器和微燃料電池等微型器件受到了研究者越來越多的關注。微型器件的應用不僅對加工工藝和材料具有較高的要求,而且需要高效的熱管理來維持其性能。特別是對于高集成度和高頻化的高性能微電子芯片而言,超高的熱流密度不僅會嚴重制約芯片的性能,而且會顯著影響芯片的壽命和可靠性。鑒于傳統的風冷和液體單相對流換熱冷卻方式無法滿足散熱需求,具有高換熱系數的微通道換熱技術成為解決微型器件散熱問題的重要途徑。然而,常規的微通道換熱技術普遍存在著高流動阻力和非均溫性的難題,限制了該技術的實際規模化應用。近年來,研究者開發出一系列新型的分形微通道技術用于換熱過程強化。本文系統總結了不同類型的分形換熱微通道(包括Y、H、T、Ψ、康托、科赫等分形結構),并對各分形微通道的原理和性能進行了著重介紹,最后對分形微通道換熱的現存挑戰和未來發展方向分別進行了分析和展望,以期為換熱過程強化的發展提供新的研究思路。

     

    Abstract: With the rapid development of microscale/nanoscale manufacturing technology, electronic microchips, microreactors, and microscale fuel cells have attracted considerable attention. The practical applications of miniaturized devices require not only advanced fabrication procedures and materials but also efficient thermal management to maintain their performance. For electronic microchips with high integration and frequency, high heat flux not only significantly limits their performance but also considerably affects their lifetime and reliability. Given that conventional air cooling and single-phase liquid convection cooling methods cannot meet the heat dissipation requirements, microchannel heat transfer technology has become an important alternative to solve the heat transfer problem of miniaturized devices. However, conventional microchannel heat transfer methods usually face two major challenges, namely, microscale dimensions that result in high-pressure drop and high-pump power consumption and temperature increase along the microchannels that considerably affect stability and reliability. The resulting high flow resistance and temperature nonuniformity significantly limit the practical applications of microchannel heat sinks. In recent years, inspired by natural fractals, such as mountain ranges, rivers, leaf venations, plant roots, tree trunks, blood vessels, and lung bronchus, researchers have developed a series of new types of fractal microchannels for heat transfer process intensification. This review provides a comprehensive overview of state-of-the-art research on fractal microchannel heat sinks, such as Y-shaped, H-shaped, T-shaped, Ψ-shaped, Cantor, and Koch fractals. We highlight the principles of heat transfer fractal microchannels, discuss the theoretical and experimental research findings, and identify the current problems and future research directions. Although research on fractal heat sinks has already gained considerable progress, the following challenges should be carefully considered: most studies focus on numerical simulations; meanwhile, experimental studies are relatively limited because of the difficulties in device fabrication. Compared with Y-shaped fractals, the other types of fractal microchannels exhibited a better performance but have received significantly less attention. Both multilayer and hydrogel-assisted fractal microchannels have typically high heat transfer capacity; however, their fabrication process is complicated. There are still a few contradictory results concerning the impact of fractal structures on heat transfer enhancement that need in-depth theoretical modeling and experimental observations. This review can not only provide an in-depth understanding of fractal microchannels but also shed new light on the development of robust fractal heat sinks for intensifying heat transfer applications.

     

/

返回文章
返回
<th id="5nh9l"></th><strike id="5nh9l"></strike><th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th><strike id="5nh9l"></strike>
<progress id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"><noframes id="5nh9l">
<th id="5nh9l"></th> <strike id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span>
<progress id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span><strike id="5nh9l"><noframes id="5nh9l"><strike id="5nh9l"></strike>
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"></span><span id="5nh9l"><video id="5nh9l"></video></span>
<th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th>
<progress id="5nh9l"><noframes id="5nh9l">
259luxu-164