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化學鍍鎳工藝對金剛石/銅復合材料表面鍍層性能的影響

Effect of electroless nickel plating process on the properties of the plating layer on diamond/Cu composite materials

  • 摘要: 通過在金剛石/銅復合材料表面上化學鍍鎳的方法使表面金屬化以改善其焊接性.研究了鍍鎳工藝對Ni-P合金鍍層中磷含量的影響,以及不同磷含量對鍍層的結合強度、耐蝕性和AgCu28釬料鋪展性的影響,并對鍍層的工藝與厚度進行了優化.AgCu28釬料在磷質量分數為5.8%~8.7%的鍍層上均表現出較好的鋪展性,且含磷8.7%的鍍層比磷含量低的鍍層的耐蝕性要好.綜合考慮鍍層與基體的結合強度和釬料在鍍層上的鋪展性,認為鍍覆時間為10~20 min的鍍層,即厚度為5~8μm時,鍍層性能最理想.

     

    Abstract: Electroless nickel plating was used to improve the weldability of diamond/Cu composites. Experiments were performed to study the influence of nickel plating process on the phosphorous content of Ni-P alloy coatings as well as the effects of phosphorous content on the bond strength between the coatings and diamond/Cu substrates, the corrosion resistance of the coatings and the spreading area of AgCu28 filler on the coatings. Besides, the coating thickness and process were optimized. It is found that AgCu28 filler on the coatings with 5.8% to 8.7% phosphorus shows good spreadability, and the coating of 8.7% P has a better corrosion resistance than that with a lower P content. In comprehensive consideration with bond strength and filler spreadability on the coatings, the coating with 10 to 20 rain plating time, namely the thickness of 5 to 8 μm, is ideal.

     

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