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熱暴露對Al-Cu-Mg-Ag合金組織和性能的影響

Effect of thermal exposure on the microstructure and properties of Al-Cu-Mg-Ag alloy

  • 摘要: 研究了Al-Cu-Mg-Ag合金經時效處理165℃×2h(欠時效態)后,在不同溫度(150~300℃)和不同時間(0~1000h)熱暴露后的顯微組織和性能.結果表明:在150℃熱暴露下,隨時間延長,其剩余強度先上升后下降,強度峰值出現在100h。在1000h后合金力學性能相對欠時效態無明顯下降;在200~300℃熱暴露時,合金的強度隨時間的延長而下降,延伸率隨著時間的延長而增大;在300℃熱暴露時,合金的強度明顯下降,暴露10h后其抗拉強度為272.5MPa,100h后其抗拉強度降至114.5MPa.欠時效狀態的合金組織主要為均勻細小分布Ω相;隨著暴露溫度的升高,Ω相長大并粗化,晶界無析出帶(PFZ)變寬.

     

    Abstract: The microstructure and mechanical properties of an Al-Cu-Mg-Ag alloy aged at 165℃ were investigated, and the underage (165℃ × 2 h) samples were subjected to thermal exposure at 150, 200, 250 and 300℃ for 0 to 1000 h. The results indicate that at the exposure temperature of 150℃, the residual strength of underage samples appears to increase first and then decrease, and the peaking strength is obtained when lasting for 100 h. The change in elongation of the samples has the same tendency as the change in residual strength. Compared with underage condition, the mechanical properties of the samples have no obvious variation after the 150℃/1000 h exposure, and thus the alloy represents a superior heat-resistance ability. With prolonging exposure time and increasing temperature, the residual strength of the samples appears to decrease and the elongation appears to increase at 200, 250, and 300℃. The residual strength of the samples obviously decrease at the exposure temperature of 300℃, and the tensile strength of the samples after the 10 h exposure is 272.5 MPa decreasing to 114.5 MPa after the 100 h exposure. At all examined temperatures the Ω plate thickening shows a linear dependence on time. With increasing exposure temperature, the Ω plate thickening kinetics greatly increases and the precipitation free zones broaden in grain boundary.

     

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