Abstract: The molecular dynamic simulation and the embedded atom method (EAM) were used to simulate the influence of thermal pulse with different frequencies on the transformation of Cu from crystalline state to non-crystalline state. The results show that the average system temperature is higher than the calculated equilibrium melting point of Cu while the transformation occurs which should be an overheated melting process, It is impossible to transfer the crystalline state into non-crystalline state under thermal pulse. With increasing thermal pulse frequency, the minimum thermal pulse energy and system overheating degree decrease.