SiCp/Al電子封裝復合材料預成形坯的制備
Preparation of SiCp/Al Electronic Packaging Composite Preforms
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摘要: 在本實驗中將SiC顆粒與粘結劑混合,溫壓制備成坯塊,進行了熱脫脂與預燒結,研究了熱脫脂一預燒結后坯塊的線性膨脹率、孔隙度、強度與工藝條件的關系,對預成形坯的顯微組織形貌進行分析.結果表明,通過有效地控制成形、脫脂與燒結等工藝參數,能制備出具有適合強度和孔隙度的預成形坯.Abstract: SiCp and binder were mixed together and SiCp preforms were prepared by warm pressing, thermal debinding and pre-sintering. The relations of the performances such as size variation, porosity and strength of the performs with process parameters were investigated. The microstructure of the performs was observed by SEM. The results show that SiCp preforms with suitable strength and porosity for preparing SiCp/Al composites can be obtained by controlling effectively the process parameters such as compaction, debinding and pre-sintering.