<th id="5nh9l"></th><strike id="5nh9l"></strike><th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th><strike id="5nh9l"></strike>
<progress id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"><noframes id="5nh9l">
<th id="5nh9l"></th> <strike id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span>
<progress id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span><strike id="5nh9l"><noframes id="5nh9l"><strike id="5nh9l"></strike>
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"></span><span id="5nh9l"><video id="5nh9l"></video></span>
<th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th>
<progress id="5nh9l"><noframes id="5nh9l">

Fe-Ni-P非晶合金的電沉積

The Electrodeposition of Amorphous FeNiP Alloy Films

    摘要
  • 摘要: 研究了電沉積法制備FeNiP非晶合金的工藝條件。以抗壞血酸作為絡合劑,選擇了合適的電鍍液,研究溶液的pH、溫度和電流密度對電鍍層的影響。

     

    Abstract: The bright FeNiP alloy film can be electroplated with using the ascorbic acid as the complex compound. Selecting suitable bath solution, the compo sition of alloy film is depended on the technological condition of pH, temperature and cathodic current density.

     

    • HTML全文
    • 參考文獻(0)
    • 相關文章
    • 施引文獻
  • 資源附件(0)

/

返回文章
返回
<th id="5nh9l"></th><strike id="5nh9l"></strike><th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th><strike id="5nh9l"></strike>
<progress id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"><noframes id="5nh9l">
<th id="5nh9l"></th> <strike id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span>
<progress id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"><noframes id="5nh9l"><span id="5nh9l"></span><strike id="5nh9l"><noframes id="5nh9l"><strike id="5nh9l"></strike>
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"><noframes id="5nh9l">
<span id="5nh9l"></span><span id="5nh9l"><video id="5nh9l"></video></span>
<th id="5nh9l"><noframes id="5nh9l"><th id="5nh9l"></th>
<progress id="5nh9l"><noframes id="5nh9l">
259luxu-164